Mechanical layer is usually used to put indicative information about board manufacturing and assembly strategies, resembling PCB dimensions, measurement markings, data materials, through information, meeting directions and other data. This information varies in accordance with the necessities of the design company or PCB manufacturer. The following examples illustrate our common methods.
Visibility Pane with entry to mask layers and zones: The Visibility Pane has been enhanced to permit designers access and control of layer content material more quickly and extra efficiently. As an alternative of a single stackup approach, the Visibility Pane now gives you fast access to simply configure and view completely different zone stackups.
– Hybrid or Combined Dielectric Boards (PTFE/fr-4 pcb mixtures)
– Metallic Backed and Metal Core PCBs
– Cavity Boards (Mechanical and Laser Drilled)
– Edge Plating
– Giant Format PCBs
– Front to again registration of etched cores to +/-.002″
– +/- 0.001″ tolerance on etched features for un-plated 1oz copper
– Blind/Buried, Through-in-Pad, Micro Vias, Stacked Vias, and Laser Through’s
– Gentle Gold and ENEPIG Plating
– Sequential lamination
One of the most fundamental parts to ensuring correct sign integrity on a bus is making sure the sign traces have the correct impedance. This is set by the trace geometries – width, thickness, and peak above the reference airplane – as properly as the board material properties, particularly the dielectric constant. In a real design, other components can affect the trace impedance, like holes in the reference planes, proximity to area fills, or neckdowns in IC or connector pinfields. Validating the right impedance alongside the complete trace route will be difficult, however is important to minimizing reflections and ensuring maximum margin.